said it has achieved a new way of looking at cellular phone semiconductors.
The Japanese-based chipmaker Thursday introduced a high-density, large-scale Multi-Chip Package (MCP) that stacks three flash, one SRAM, and two Fast Cycle RAM (FCRAM) devices in a single package for applications.
The new PS-MCP is available in standard plastic 179-pin BGA but extremely pricey. Sample prices start at $65 each and will be available by the end of November.
Based on technology introduced in March of this year, Fujitsu’s new six-chip MB84VY6A4A1 MCP bonds a pair of packages two independent data buses, so data and programs can be processed simultaneously.
The company said it stacked its MCP for the cellular phone market, which now requires so many different types of memory to serve a variety of new functions in addition to phone calls. The idea is to make memory packages smaller with higher densities and larger capacities.
“This is a breakthrough product for the new generation of full-function cellular technology,” said Keith Horn, vice president of marketing for Fujitsu Microelectronics America. “As cellular phones incorporate video capture, Internet access and other exciting new features, they require significantly more memory in very dense packages.”
The MCP is divided into a four-chip upper package and a two-chip lower package. The upper package includes 128-Mbit NOR-type dual operation flash memory with page read mode, 64-Mbit NOR-type dual operation flash memory, 64-Mbit mobile FCRAM, and 32-Mbit mobile FCRAM. The lower section includes 32-Mbit NOR-type dual operation flash, with 8-Mbit low-power SRAM.
The six-chip stack is the same size as Fujitsu’s four-chip stack. The company also said the new chip is also resilient in average temperatures and can accommodate up to 100,000 erase/write repetitions.