Intel Goes Gigabit with StrataFlash

Looking to advance its presence in the mobile marketplace, Intel Tuesday rolled out its StrataFlash Wireless Memory System for next generation handsets.

The small 8x11mm package is designed for storing memory for large embedded data applications such as camera images, audio and video files.

Based on Santa Clara, Calif.-based Intel’s Multi-Level Cell (MLC) technology, which doubles the amount of information stored in each memory cell, the system contains code execution, data storage and RAM working space — three types of memory functionality the company says wireless developers repeatedly ask for.

“[We] offer a complete wireless solutions from cost-competitive memory systems to combinations of memory and logic products to simplify designs that add more functionality in a small space, while saving cost for wireless handset makers,” Intel senior vice president Ron Smith said during his keynote today at the Intel Developer Forum in Taiwan.

The memory system is also part of Intel’s Stacked Chip Scale Packaging (Stacked-CSP) product line, which offers a common package pin out and the same Intel Flash file management software as the rest of the family making upgrades less painful. Intel’s 1.8-volt StrataFlash chips are based on the 0.13-micron process technology and memory densities up to 1 Gb.

And while the No. 1 chipmaker does have a history in making Flash memory it does compete with other memory makers including AMD’s recently developed Mirror Bit Memory.

Intel says the product (part number LV18/LV30) is currently sampling, with production volumes starting in February 2004. The company said prices will depend on specific flash and RAM memory combinations.

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