Sun, TI Team for Wireless Java Services

Sun Microsystems and Texas Instruments (TI) Thursday said they have teamed up to create Java-based wireless
applications for 2.5G and 3G networks.


Santa Clara, Calif.’s Sun and Dallas-based TI have indicated they believe
their partnership will spark demand for converged voice and wireless
multimedia devices among consumers while simultaneously helping handheld
device makers and wireless services providers cut costs of the solutions
they provide to the public.


Wireless momentum in the form of 2.5G and 3G have been raved about for the
last few years, but the steam has been largely relegated to Asia-Pacific
regions and Europe as technology innovators who aim to sell wireless
software, devices and services try to spark demand in North America.


Companies such as Sun, Microsoft and IBM have been at the forefront of such
developments, along with a number of smaller niche players whose products
complement those of the larger vendors. Despite the lukewarm demand in the
U.S. and competition from the Windows platform, Sun has persisted in its
belief that Java-based applications on a slew of mobile smartphones and
handheld PCs will constitute a cash cow.


Sun has recently announced that the shipment of mobile Java devices exceeded
the 120 million-unit milestone. Teaming with TI, a leader in chips for
wireless products, reinforces its position.


Financial terms of the deal were not revealed, but TI has licensed Sun’s
Connected Limited Device Configuration HotSpot Implementation (CLDC HI) to
be fused with its family of TCS chipsets for GSM/GPRS , EDGE,
CDMA and UMTS-enabled handsets and
wireless OMAP applications processors.

CLDC HI is a Java virtual machine that is optimized for gadgets like PDAs,
set-top boxes and other consumer products and embedded devices.
The companies believe this make the creation of Java applications on
handsets easier, which will in turn lead to a higher quality consumer
experience.


Sun and TI also are working together to provide Mobile Information Device
Profile 2.0 (MIDP 2.0), which, when combined with CLDC is the Java runtime
environment for devices such as phones and entry-level PDAs, on TI’s TCS
wireless chipsets and OMAP processors.


The vendors believe this will help device makers craft Java-enabled gadgets
in an easier fashion. Sun and TI will also validate the Java implementation
on TI’s OMAP platform with Sun’s Content Delivery Server to make it easier
for mobile operators to roll out Java-based mobile data services.


TI expects to offer GPRS chipsets and handset reference
designs including Sun’s CLDC HI by the second quarter of 2004. MIDP 2.0 that
interoperates with CLDC HI on TI’s OMAP platform is expected to be available
from Sun by the second quarter of 2004.


“Widespread deployment of compelling new applications based on open
standards-based platforms will drive consumer demand for 2.5G and 3G
wireless handsets and services,” said Rick Kornfeld, vice president and
general manager of TI’s Wireless Chipset Business Unit.


IDC highlighted the value of wireless services in a recent survey. In a
recent survey of more than 450 senior decision makers and influencers across
North America, the high-tech research group found that improving operational
efficiency and productivity are key factors driving corporate investments in
wireless and mobile solutions.

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