Nokia Friday said it will stand behind a new wireless standard started by Texas Instruments
and STMicroelectronics
.
The Finland-based cell phone maker called the Open Mobile Application Processor Interfaces (OMAPI) is “a significant and positive step in building open mobile application processor interfaces, as well as boosting growth in the mobile industry.”
Launched back in December 2002, TI and STM say their standard can improve how multimedia looks and runs on 2.5G and 3G mobile phones, PDAs and other mobile devices.
The platform is based on TI’s popular OMAP standard but as part of the first phase of the initiative, the two companies added on a specific set of software and hardware interfaces defining common application peripherals especially where multimedia is concerned.
“Nokia is pleased to see that the semiconductor industry is adopting a similar approach to its business as the mobile industry has done in respect to middleware harmonization through the Open Mobile Alliance (OMA). By developing common interfaces, the semiconductor manufacturers significantly reduce the amount of work needed for implementing their products in mobile terminals. But even more importantly, the benefits of their cooperation extend across the entire mobile value chain by reducing complexity and fuelling innovation in terms of application and peripheral development and reducing cost,” said Nokia CTO Yrjo Neuvo.
The standard is expected to go head-to-head with current mobile chip products such as Intel XScale
Nokia Friday said it will stand behind a new wireless standard started by Texas Instruments
and STMicroelectronics
.
The Finland-based cell phone maker called the Open Mobile Application Processor Interfaces (OMAPI) is “a significant and positive step in building open mobile application processor interfaces, as well as boosting growth in the mobile industry.”
Launched back in December 2002, TI and STM say their standard can improve how multimedia looks and runs on 2.5G and 3G mobile phones, PDAs and other mobile devices.
The platform is based on TI’s popular OMAP standard but as part of the first phase of the initiative, the two companies added on a specific set of software and hardware interfaces defining common application peripherals especially where multimedia is concerned.
“Nokia is pleased to see that the semiconductor industry is adopting a similar approach to its business as the mobile industry has done in respect to middleware harmonization through the Open Mobile Alliance (OMA). By developing common interfaces, the semiconductor manufacturers significantly reduce the amount of work needed for implementing their products in mobile terminals. But even more importantly, the benefits of their cooperation extend across the entire mobile value chain by reducing complexity and fuelling innovation in terms of application and peripheral development and reducing cost,” said Nokia CTO Yrjo Neuvo.
The standard is expected to go head-to-head with current mobile chip products such as Intel XScale, although some synergy is expected since the No. 1 chipmaker is one of the founding members of OMA.
