Continuing to drive advancements in processor performance is a monumental undertaking. But it’s at the heart of what major chipmakers need to do, and at the International Solid-State Circuits Conference next week, industry leader Intel is outlining some prospective approaches it’s exploring to help it do just that. HardwareCentral takes a look.
The International Solid-State Circuits Conference (ISSCC) is not a show for the casual technology enthusiast or mere mortals with less than a Ph.D. in electrical engineering. They don’t simplify the topics for easy, mass consumption. It’s a forum for serious engineering discussions and it’s up to you to keep up.
One sample paper for discussion at the show: “A 320mV-to-1.2V On-Die Fine-Grained Reconfigurable Fabric for DSP/Media Accelerators in 32nm CMOS.” Try saying that five times fast. The paper will discuss a chip fabric that could be reconfigured for a variety of purposes.
So keeping up with the advanced briefing Intel provided Wednesday on the papers it will present at the show was a challenge in and of itself. Nasser Kurd, senior principal engineer in the Intel Architecture Group, and Randy Mooney, Intel Fellow and director of Intel Labs, I/O Research, provided a look into Intel’s offerings.